a b
Fig. 76.—Microstructure of Commercial Copper containing Oxygen (Hofman).
| a. Calumet and Hecla copper after 60 minutes’ poling. | b. Calumet and Hecla “dry” copper before poling. |
| 0·22 per cent. oxygen = 1·98 per cent. Cu2O. | 0·64 per cent. oxygen = 5·76 per cent. Cu2O. |
Compare with [Fig. 6, p. 28]. | |
| (By permission of American Institution of Mining Engineers.) | |
References.
Ulke, T., “Modern Electrolytic Copper Refining.” (With complete Bibliography).
Peters, E. D., “Modern Copper Smelting” (1905). (Chapter xviii. by M. Barnett.).
Mineral Industry. Annual Review.
Cowper Coles, S., “An Electrolytic Process for the Production of Copper Wire.” Proc. B’ham. Met. Soc., 1908–9, p. 5.